04/28/2024 What I Read Last Week
#DigitalInfrastructure news: IBM, Billions in data center builds, TSMC
Weekly Edition of curated news about Digital Infrastructure
[Link] IBM acquires HashiCorp for $6.4 billion. I think this is a pretty good fit… as their press release states, the total cloud opportunity according to IDC had a total addressable market of $1.1 trillion in 2023. The acquisition by IBM creates a comprehensive end-to-end hybrid cloud platform built for AI-driven complexity.
The statistics on data center capacity and growth are really something else. This past week alone had quite a bit of activity in the global build-out of data center capacity:
[Link] Vantage enters the Irish market with the development of a multi-phase data center campus in Dublin. The 405,000 square foot (38,000 square meter) campus will consist of one 32MW facility and one 20MW facility and has available land and power to add a third facility in the future.
[Link] Amazon plans to build an $11 billion data center in northern Indiana.
[Link] Google announces $2 billion data center campus in Fort Wayne, Indiana. The company also announced a collaboration with Indiana Michigan Power Company to add clean energy to the local grid.
[Link] Meta forecasts 2024 capital expenditures in the range of $35-$40 billion. CEO Mark Zuckerberg said, "As we're scaling CapEx and energy expenses for AI, we'll continue focusing on operating the rest of our company efficiently but - realistically - even with shifting many of our existing resources to focus on AI, we'll still grow our investment envelope meaningfully before we make much revenue from some of these new products.”
[Link] Atlas Edge has entered the Portuguese market with the acquisition of two adjacent sites in Lisbon that will deliver more than 20MW of IT load.
[Link] CoreWeave is building 28 new data centers across North America to try and keep pace with the insatiable demand of AI workloads. CoreWeave’s Brannin McBee was on the This Week in Startups podcast recently to discuss the energy dynamics of GPUs, innovations in data center cooling, and the future challenges and impacts of AI infrastructure.
[Link] TSMC has announced its 1.6nm-class process technology, called A16, which will be the company's first Angstrom-class production node. The most significant innovation of this new process is the introduction of a backside power delivery network (BSPDN) called Super Power Rail (SPR). This technology is specifically tailored for AI and HPC processors that require complex signal wiring and dense power delivery networks.
[Link] Vapor IO and VAST Data have joined their platforms to offer an edge-to-core AI fabric capable of simultaneously catering to a wide range of business priorities. This AI fabric gives enterprises the flexibility they need to tailor the system for their specific use cases, optimizing for critical factors such as cost, latency, accuracy, and resiliency.
[Link] Telefónica, IDEMIA & Quside Unveils Quantum-Safe Connection for industrial IoT Devices.
🤯 [Link] NASA’s Optical Comms Demo Transmits Data Over 140 Million Miles.
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