Weekly Edition of curated news about Digital Infrastructure
[Link] Google was named in documents last Thursday, as the company behind the new $576 million data center in Cedar Rapids. For that price tag I had figured it was one of the hyper-scalers, but with their large presence in Iowa already (Council Bluffs), I did not think it would be Google. Alliant Energy, the City of Cedar Rapids, the Cedar Rapids Metro Economic Alliance, ITC Midwest, and the IEDA collaborated to bring this project to fruition. The agreement included a 20-year, 70 percent tax exemption, a monthly credit of $1.30 per cubic feet of gray wastewater discharge, and a $36 community betterment fund. #IowaRules #IowaBrag #YIMBY Google-Our home in the Hawkeye state.
NVIDIA News
[Link] NVIDIA launches Blackwell-powered DGX SuperPOD for generative AI supercomputing at trillion-parameter scale. Featuring a new liquid-cooled rack-scale architecture, the new DGX SuperPOD is built with NVIDIA DGX GB200 systems, and provides 11.5 exaflops of AI supercomputing at FP4 precision and 240 terabytes of fast memory — scaling to more with additional racks.
[Link] AWS and NVIDIA announced that they will continue to bring together the best of their technologies, with the new NVIDIA Blackwell GPU platform coming to AWS (Grace Blackwell GPU-based Amazon EC2 instances and NVIDIA DGX Cloud).
[Link] As a part of the NVIDIA CUDA-X microservices, NVIDIA announced its Earth-2 climate digital twin cloud platform for simulating and visualizing weather and climate at unprecedented scale.
[Link] Intel announced that the U.S. has proposed up to $8.5 billion in direct funding through the CHIPS and Science Act to advance Intel’s commercial semiconductor projects in Arizona, New Mexico, Ohio, and Oregon. Intel also expects to benefit from a U.S. Treasury Department Investment Tax Credit (ITC) of up to 25% on more than $100 billion in qualified investments and eligibility for federal loans up to $11 billion.
[Link] Intel and ARM have signed an agreement for an initiative that builds on the April 2023 multigeneration agreement to enable chip designers to build low-power compute system-on-chips on the Intel 18A process.
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